[ Equipment introduction ]
● Used for thinning the back of 300mm wafer
● Two sand wheel shafts, no need to replace the grinding wheel to complete rough grinding and fine grinding
[ Main features ]
● Automatically complete the process of taking, centering, wetting, rough grinding, fine grinding, unloading, cleaning and drying, loading
● With automatic thickness compensation, grinding wheel automatic knife and other functions
● Both the grinding wheel spindle and the workpiece spindle adopt high-precision and high-stiffness aerostatic bearings
● Man-machine user control screen can synchronously display processing status and equipment status
[ The main parameters ]
Dimension of grinding wafers: ∅300mm
Sand wheel spindle type: qi floating spindle
Number of sand wheel spindles: 2
Sand wheel spindle speed: 1000 ~ 4000RPM
Z axis itinerary: 130mm
Z axis grinding speed: 0.0001 ~ 0.08mm/s
Z -axis minimum amount of feed: 0.1 μm
Wall thickness measurement range: 0 ~ 1800 μm
Thickness measurement resolution: 0.1 μm
Number of wafers: 3
Walls Workbench Speed: 0 ~ 300RPM
Sand wheel diameter: ∅300mm
Number of wafers: 2
Wall treatment: flushing and drying
After grinding, wafers ttv: ≤1.5μm
Disginal deviation between the tape after grinding: 3 μm
Uph: 20-30Pcs/H
Surface roughness: Ra≤10nm, Ry0.1μm
[ Example Effect ]
The grinding 300mm wafer
Before thinning——After thinning
